Laser Dicing Silicon Wafer

Laser Dicing Silicon Wafer

Laser dicing a silicon wafer is a vital process in the creation of electronics. Finding a company with the knowledge and power to avoid making mistakes ensures lower costs and better quality. Laserod deploys femtosecond laser technology capable of high precision and accuracy with over 40 years of experience to avoid unwanted errors in the manufacturing process.

What is dicing?

Integrated circuits print on semiconducting materials. They are typically produced in large batches on a single wafer of electronic-grade silicon.

Dicing separates circuits from the wafer after processing. This allows circuits to be printed quickly and efficiently.

How is dicing accomplished?

Dicing involves multiple precise and accurate cuts. The process includes mechanical sawing, scribing, breaking, and laser cutting.

During dicing, technicians mount wafers on dicing tape which has a sticky backing against a thin metal frame. Different tapes are used for different circuit sizes with some die streets of about 75 micrometers left over.

What machines are used to cut semiconductors?

Water jets, mechanical devices, and lasers are all used to cut wafers. Each requires a different procedure.

Mechanical devices are more likely to create inaccuracies in the process. Parts wear and machines must be calibrated for issues that occur over time.

How accurate is laser cutting?

Laser cutting is an incredibly accurate process. Femtosecond laser processing cuts with a high degree of accuracy and precision.

A laser’s power depends on the pulse rate and bandwidth. Laserod femtosecond cutters provide extremely low tolerances with a typical tolerance of less than 0.025mm.

Can I dice with only a laser cutter?

It is possible to use a laser for cutting, drilling, scribing, and the remainder of the dicing process. The use of a laser is known as stealth-dicing.

The process proceeds in two steps. Regions are first introduced to the wafer using a scanning beam. The laser is then pulsed at a specific rate with a wavelength appropriate for your electronics. A small defected region is required to protect against excess fracturing.

Extreme accuracy through solid-state cutting

Laserod uses highly accurate solid-state laser to achieve results within low tolerance bands when appropriate. Solid-state lasers outperform their CO2 counterparts.

Most laser cutting involves IR, green, UV, or hi power lasers. When used, solid-state lasers achieve wavelengths of 1.06 microns in comparison to the 10.6 microns. An excimer laser has an even smaller wavelength of .248 microns.

Laser dicing a silicon wafer

Laser-based dicing is precise and accurate with incredibly small wavelengths that reduce defects. The two-part process replaces the use of mechanical lasers and water jets to better break apart the multiple circuits placed on a single silicon wafer.

Laserod, with over 40 years of experience, is ready to help you achieve the results you need within demanding tolerance levels. Our expert technicians are helping Stanford University build the new South Pole Telescope.

When your project demands results, Laserod is ready to provide. Get in touch with us today for the production of quality circuits.

Laser Dicing Silicon Wafer

Laserod Technologies, LLC


Laser Dicing Silicon Wafer

20312 Gramercy Pl


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